Silicon EPI wafer is mainly used in processing semiconductor wafers made from materials such as silicon or epitaxial growth. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
Global semiconductor wafer polishing and grinding equipment market is set to witness a substantial CAGR of 7.45% in the forecast period of 2019-2026. The report contains data of the base year 2018, historic year 2017. Increasing consumption of consumer electronics and rising outsourcing activities is another factor for the growth of this market.